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The ProLab Design PL-LGA4189-2UN is a compact high-performance 2U Server CPU Cooler designed specifically for Intel LGA4189 rectangular motherboard platforms, making it ideal for enterprise servers, virtualization hosts, cloud infrastructure, edge computing systems, and dense rackmount deployments. Engineered for modern Intel Xeon Scalable processors, the cooler delivers efficient thermal management for continuous enterprise workloads while maintaining compatibility with compact server chassis environments.
Built with a high-efficiency aluminum fin heatsink assembly and 5 integrated heat pipes, the PL-LGA4189-2UN is optimized for rapid heat dissipation and stable thermal transfer across high-performance server processors. Supporting CPUs with power requirements up to 320W, the cooler is engineered to maintain reliable operating temperatures for demanding compute environments and mission-critical enterprise systems.
The industrial-grade PWM cooling fan operates between 2100 and 8000 RPM, delivering up to 34.74 CFM airflow for concentrated cooling performance across dense heatsink fin arrays. Equipped with durable double ball bearings and a 4-pin PWM connector, the fan dynamically adjusts cooling performance according to processor thermal load while ensuring long-term reliability in 24/7 server environments. The cooling system is designed for optimized airflow within compact rackmount chassis while maintaining a maximum acoustic output of 54.34 dBA.
With compact dimensions of 113mm x 80mm x 66.3mm, the PL-LGA4189-2UN is purpose-built for compatibility with 2U rackmount server chassis and other space-constrained enterprise systems. The reinforced mounting mechanism ensures secure installation and effective pressure distribution across Intel LGA4189 processors for stable long-term operation.
Combining enterprise-grade thermal engineering, compact airflow optimization, and support for Intel Xeon server platforms, the ProLab Design PL-LGA4189-2UN is an ideal cooling solution for virtualization servers, storage systems, cloud compute nodes, AI edge deployments, and high-density enterprise computing environments requiring efficient cooling performance in compact form factors.
