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The ProLab Design PL-LGA1700-2US is a compact high-performance 2U Server CPU Cooler engineered for Intel LGA1700 and LGA1851 platforms, making it ideal for dense rackmount servers, edge computing systems, compact workstations, and enterprise deployments where space efficiency and thermal performance are equally critical.
Built with a pure copper baseplate and 5 high-efficiency copper heatpipes, the PL-LGA1700-2US is capable of handling processors up to 235W TDP, providing reliable cooling for modern high-performance Intel CPUs operating under continuous enterprise and workstation workloads.
The cooler features an industrial-grade 60mm PWM FAN operating between 2600 to 8000 RPM, delivering up to 47.2 CFM airflow and an impressive 7 mmH₂O static pressure. This high-pressure airflow design enables effective heat dissipation in restrictive 2U rackmount chassis environments where airflow resistance is significantly higher compared to standard desktop systems.
Designed specifically for 2U or larger rackmount chassis, the PL-LGA1700-2US combines compact dimensions with enterprise-grade cooling capability, allowing system integrators to deploy powerful Intel-based systems in space-constrained server racks without compromising thermal stability.
With optimized airflow engineering, high static pressure performance, and compatibility with the latest Intel processor platforms, the PL-LGA1700-2US is an ideal cooling solution for virtualization servers, edge AI systems, networking appliances, compact render nodes, and high-density compute infrastructure.
