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The ProLab Design PL-LGA3647-2UN is a compact high-performance 2U Server CPU Cooler engineered specifically for Intel LGA3647 platforms, designed for enterprise servers, cloud infrastructure, virtualization systems, storage servers, and high-density rackmount deployments. Optimized for rectangular Intel Xeon Scalable motherboard layouts, the cooler delivers reliable thermal management for enterprise workloads operating in compact server environments where airflow efficiency and space optimization are critical.
Built with a copper base, aluminum fin heatsink, and 4 high-efficiency copper heat pipes, the PL-LGA3647-2U is designed to provide rapid heat transfer and stable thermal dissipation for Intel server processors with power requirements up to 225W. The optimized thermal structure ensures dependable cooling performance during sustained workloads in enterprise and data center applications.
The integrated PWM-controlled cooling fan operates between 2600 and 8000 RPM, delivering up to 47.20 CFM airflow for aggressive heat dissipation within compact 2U rackmount chassis. Equipped with a durable double ball bearing mechanism and 4-pin PWM fan control, the cooling system dynamically adjusts fan speed according to thermal load while maintaining long-term operational reliability for continuous 24/7 server usage. The focused airflow design is optimized for dense server environments requiring efficient cooling across restricted airflow pathways.
With compact dimensions of 108mm x 78mm x 64.5mm, the PL-LGA3647-2U is specifically engineered for space-constrained rackmount deployments while maintaining compatibility with Intel LGA3647 rectangular motherboard configurations. The reinforced mounting structure ensures secure installation and stable contact pressure for efficient heat transfer across enterprise-grade processors.
Combining enterprise-grade thermal engineering, multi-heatpipe cooling architecture, PWM-controlled airflow optimization, and support for Intel Xeon Scalable platforms, the ProLab Design PL-LGA3647-2U is an ideal cooling solution for virtualization hosts, compact servers, storage platforms, cloud infrastructure, edge computing systems, and high-density enterprise deployments requiring powerful thermal performance in a low-profile form factor.
