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The ProLab Design PL-LGA3647-4US is a high-performance 4U Server CPU Cooler engineered specifically for Intel LGA3647 square motherboard platforms, designed for enterprise servers, virtualization infrastructure, AI compute systems, rendering nodes, and high-density data center environments. Optimized for Intel Xeon Scalable processors, the cooler delivers reliable thermal management for sustained enterprise workloads requiring stable cooling performance under continuous operation.
Built with a copper base, aluminum fin heatsink array, and 5 high-efficiency copper heat pipes, the PL-LGA3647-4U-S is designed for rapid heat transfer and efficient thermal dissipation across high-core-count Intel server CPUs. Supporting processors with power requirements up to 240W, the cooler ensures dependable thermal stability for demanding compute-intensive enterprise applications.
The integrated PWM-controlled industrial cooling fan operates between 1900 and 3800 RPM, delivering up to 61.46 CFM airflow for optimized heat dissipation within enterprise rackmount chassis. Equipped with a durable double ball bearing mechanism and 4-pin PWM fan control, the fan dynamically adjusts airflow based on processor thermal load while maintaining long-term reliability for continuous 24/7 operation. The cooling system is engineered to balance strong airflow performance with comparatively controlled acoustics, maintaining a maximum noise level of 44 dBA.
With compact dimensions of 91mm x 88mm x 125.5mm, the PL-LGA3647-4U-S is specifically designed for compatibility with Intel LGA3647 square motherboard layouts and 4U rackmount server deployments. The reinforced mounting mechanism ensures secure installation and stable pressure distribution for efficient thermal transfer across enterprise-grade processors.
Combining enterprise-grade airflow optimization, multi-heatpipe thermal engineering, and support for Intel Xeon Scalable server platforms, the ProLab Design PL-LGA3647-4U-S is an ideal cooling solution for virtualization hosts, AI servers, cloud infrastructure, enterprise databases, rendering systems, and high-performance computing deployments requiring reliable thermal management and long-term operational stability.
