Built with a copper base, high-density aluminum fin heatsink assembly, and 6 high-efficiency heat pipes, the PL-SP6-4U PRO is optimized for rapid heat transfer and effective thermal dissipation across high-core-count AMD server CPUs. Supporting processors with power requirements up to 355W, the cooler is engineered to maintain stable operating temperatures under sustained enterprise and compute-intensive workloads.

The industrial-grade PWM cooling fan operates between 2000 and 5000 RPM, delivering an exceptional airflow capacity of up to 128.00 CFM for aggressive heat dissipation across dense heatsink fin arrays. Equipped with durable double ball bearings and a 4-pin PWM connector, the fan dynamically adjusts airflow performance according to processor thermal demand while ensuring long-term operational reliability in 24/7 server environments. The cooling solution is designed to provide high airflow efficiency while maintaining a controlled maximum acoustic output of 45 dBA.

With dimensions of 118mm x 100mm x 126mm, the PL-SP6-4U PRO is purpose-built for compatibility with 4U and above rackmount chassis, offering an ideal balance between thermal capability and deployment flexibility. The reinforced mounting mechanism ensures secure installation and optimized contact pressure distribution across AMD SP6 processors for stable and reliable long-term operation.

Combining enterprise-grade thermal engineering, powerful airflow optimization, and support for AMD EPYC server platforms, the ProLab Design PL-SP6-4U PRO is an ideal cooling solution for AI servers, virtualization hosts, cloud infrastructure, rendering systems, edge computing deployments, and high-density enterprise computing environments requiring dependable high-performance cooling.

Built with a high-efficiency aluminum fin heatsink assembly and 5 integrated heat pipes, the PL-LGA4189-2UN is optimized for rapid heat dissipation and stable thermal transfer across high-performance server processors. Supporting CPUs with power requirements up to 320W, the cooler is engineered to maintain reliable operating temperatures for demanding compute environments and mission-critical enterprise systems.

The industrial-grade PWM cooling fan operates between 2100 and 8000 RPM, delivering up to 34.74 CFM airflow for concentrated cooling performance across dense heatsink fin arrays. Equipped with durable double ball bearings and a 4-pin PWM connector, the fan dynamically adjusts cooling performance according to processor thermal load while ensuring long-term reliability in 24/7 server environments. The cooling system is designed for optimized airflow within compact rackmount chassis while maintaining a maximum acoustic output of 54.34 dBA.

With compact dimensions of 113mm x 80mm x 66.3mm, the PL-LGA4189-2UN is purpose-built for compatibility with 2U rackmount server chassis and other space-constrained enterprise systems. The reinforced mounting mechanism ensures secure installation and effective pressure distribution across Intel LGA4189 processors for stable long-term operation.

Combining enterprise-grade thermal engineering, compact airflow optimization, and support for Intel Xeon server platforms, the ProLab Design PL-LGA4189-2UN is an ideal cooling solution for virtualization servers, storage systems, cloud compute nodes, AI edge deployments, and high-density enterprise computing environments requiring efficient cooling performance in compact form factors.

Built using a copper base, aluminum fin heatsink assembly, and 6 high-efficiency heat pipes, the PL-LGA4189-4U is optimized for rapid heat transfer and efficient thermal dissipation across high-core-count server CPUs. Supporting processors up to 350W power consumption, the cooler is designed to maintain stable operating temperatures for demanding enterprise computing workloads and mission-critical server deployments.

The industrial-grade PWM cooling fan operates between 1300 and 3800 RPM, delivering up to 42.64 CFM airflow for focused cooling performance across dense heatsink fin arrays. Equipped with durable double ball bearings and a 4-pin PWM connector, the fan dynamically adjusts airflow based on processor thermal demand while ensuring long-term reliability in continuous 24/7 operating environments. The cooling solution is engineered to provide efficient airflow optimization while maintaining comparatively controlled acoustic levels of 36.74 dBA maximum.

With dimensions of 116.7mm x 92.5mm x 125.5mm, the PL-LGA4189-4U is purpose-built for compatibility with 4U and above rackmount server chassis. The reinforced mounting structure ensures secure installation and optimal contact pressure distribution across Intel LGA4189 processors for stable and reliable long-term operation.

Combining enterprise-grade thermal engineering, optimized airflow performance, and support for Intel Xeon server platforms, the ProLab Design PL-LGA4189-4U is an ideal cooling solution for AI servers, virtualization hosts, rendering systems, high-density compute environments, cloud infrastructure, and enterprise-class server deployments requiring dependable high-performance cooling.

Built using a copper base, aluminum fin heatsink assembly, and 4 high-efficiency copper heat pipes, the PL-LGA3647-2U-S is engineered to provide rapid heat transfer and stable thermal dissipation for enterprise-grade processors. Supporting CPUs with power requirements up to 205W, the cooler delivers dependable thermal management for demanding server applications while maintaining compatibility with space-constrained rackmount systems.

The industrial-grade PWM cooling fan operates between 2100 and 6800 RPM, delivering up to 34.50 CFM airflow for focused heat dissipation across dense heatsink fin arrays. Equipped with durable double ball bearings and a 4-pin PWM connector, the fan dynamically adjusts cooling performance based on processor thermal load while ensuring long-term operational reliability in 24/7 server environments. The cooling system is optimized for compact chassis airflow management while maintaining a maximum acoustic output of 52 dBA.

With compact dimensions of 91mm x 88mm x 64.5mm, the PL-LGA3647-2U-S is purpose-built for 2U and compact rackmount server chassis compatibility. The reinforced mounting design ensures secure installation and efficient contact pressure distribution across Intel LGA3647 processors for stable long-term operation.

Combining enterprise-grade thermal engineering, compact airflow optimization, and support for Intel Xeon server platforms, the ProLab Design PL-LGA3647-2U-S is an ideal cooling solution for virtualization hosts, enterprise compute nodes, storage servers, cloud platforms, rendering systems, and high-density server deployments requiring efficient cooling performance in space-constrained environments.

Built with a copper base, aluminum fin heatsink array, and 5 high-efficiency copper heat pipes, the PL-LGA3647-4U-S is designed for rapid heat transfer and efficient thermal dissipation across high-core-count Intel server CPUs. Supporting processors with power requirements up to 240W, the cooler ensures dependable thermal stability for demanding compute-intensive enterprise applications.

The integrated PWM-controlled industrial cooling fan operates between 1900 and 3800 RPM, delivering up to 61.46 CFM airflow for optimized heat dissipation within enterprise rackmount chassis. Equipped with a durable double ball bearing mechanism and 4-pin PWM fan control, the fan dynamically adjusts airflow based on processor thermal load while maintaining long-term reliability for continuous 24/7 operation. The cooling system is engineered to balance strong airflow performance with comparatively controlled acoustics, maintaining a maximum noise level of 44 dBA.

With compact dimensions of 91mm x 88mm x 125.5mm, the PL-LGA3647-4U-S is specifically designed for compatibility with Intel LGA3647 square motherboard layouts and 4U rackmount server deployments. The reinforced mounting mechanism ensures secure installation and stable pressure distribution for efficient thermal transfer across enterprise-grade processors.

Combining enterprise-grade airflow optimization, multi-heatpipe thermal engineering, and support for Intel Xeon Scalable server platforms, the ProLab Design PL-LGA3647-4U-S is an ideal cooling solution for virtualization hosts, AI servers, cloud infrastructure, enterprise databases, rendering systems, and high-performance computing deployments requiring reliable thermal management and long-term operational stability.

Built with a copper base, aluminum fin heatsink, and 4 high-efficiency copper heat pipes, the PL-LGA3647-2U is designed to provide rapid heat transfer and stable thermal dissipation for Intel server processors with power requirements up to 225W. The optimized thermal structure ensures dependable cooling performance during sustained workloads in enterprise and data center applications.

The integrated PWM-controlled cooling fan operates between 2600 and 8000 RPM, delivering up to 47.20 CFM airflow for aggressive heat dissipation within compact 2U rackmount chassis. Equipped with a durable double ball bearing mechanism and 4-pin PWM fan control, the cooling system dynamically adjusts fan speed according to thermal load while maintaining long-term operational reliability for continuous 24/7 server usage. The focused airflow design is optimized for dense server environments requiring efficient cooling across restricted airflow pathways.

With compact dimensions of 108mm x 78mm x 64.5mm, the PL-LGA3647-2U is specifically engineered for space-constrained rackmount deployments while maintaining compatibility with Intel LGA3647 rectangular motherboard configurations. The reinforced mounting structure ensures secure installation and stable contact pressure for efficient heat transfer across enterprise-grade processors.

Combining enterprise-grade thermal engineering, multi-heatpipe cooling architecture, PWM-controlled airflow optimization, and support for Intel Xeon Scalable platforms, the ProLab Design PL-LGA3647-2U is an ideal cooling solution for virtualization hosts, compact servers, storage platforms, cloud infrastructure, edge computing systems, and high-density enterprise deployments requiring powerful thermal performance in a low-profile form factor.

Constructed with a copper base, aluminum fin stack, and 6 high-efficiency copper heat pipes, the PL-LGA3647-4U is optimized for rapid heat transfer and efficient thermal dissipation across high-core-count server processors. Designed to support CPUs with power requirements up to 265W, the cooler ensures stable operating temperatures during continuous heavy computational workloads common in enterprise and cloud infrastructure environments.

The integrated PWM-controlled 92.5mm industrial cooling fan operates between 1900 and 3800 RPM, delivering up to 61.46 CFM airflow for strong and focused cooling performance within 4U server chassis. Equipped with a durable double ball bearing mechanism and 4-pin PWM fan control, the cooling system dynamically adjusts airflow based on processor thermal demand while maintaining long-term operational reliability for 24/7 enterprise deployments. Despite its high airflow capability, the cooler maintains comparatively controlled acoustic performance with a maximum noise level of 44 dBA.

Designed for rectangular Intel LGA3647 motherboard layouts, the PL-LGA3647-4U features a compact yet efficient thermal architecture with dimensions of 116.2mm x 92.5mm x 125.5mm, making it suitable for 4U rackmount server chassis and workstation-class systems. The reinforced mounting system ensures secure installation and optimal contact pressure for stable cooling performance across enterprise-grade processors.

Combining enterprise-grade airflow optimization, multi-heatpipe thermal engineering, and support for Intel Xeon Scalable platforms, the ProLab Design PL-LGA3647-4U is an ideal cooling solution for virtualization hosts, AI servers, cloud infrastructure, rendering systems, enterprise databases, and high-performance computing deployments requiring dependable thermal management and continuous operational stability.

Built with an advanced VC (Vapor Chamber) heat spreader plate combined with high-efficiency copper fins, the PL-LGA1700-1UC-VC provides enhanced thermal transfer and rapid heat distribution across the heatsink surface. Designed to support high-TDP processors ranging from 200W to over 500W, the cooler delivers stable thermal performance for enterprise-grade Intel platforms operating under sustained heavy workloads.

The integrated 90mm PWM industrial cooling fan operates between 1500 to 6600 RPM, delivering up to 21.35 CFM airflow for aggressive heat dissipation in dense rackmount environments. Equipped with a durable double ball bearing design and 4-pin PWM control, the fan dynamically adjusts cooling performance based on system load while maintaining long-term reliability in continuous 24/7 operation. The optimized airflow design ensures efficient thermal management for compact server systems handling intensive compute workloads.

With compact dimensions of 90mm x 90mm x 28mm and support for Intel LGA1700 square motherboard mounting layouts with 78mm x 78mm hole spacing, the PL-LGA1700-1UC-VC is specifically engineered for compatibility with 1U rackmount server chassis and embedded enterprise systems. The reinforced mounting mechanism provides secure installation and optimal contact pressure for stable cooling efficiency across high-performance processors.

Combining vapor chamber thermal technology, copper fin construction, enterprise-grade airflow optimization, and support for high-power Intel CPUs, the ProLab Design PL-LGA1700-1UC-VC is an ideal cooling solution for AI edge servers, virtualization platforms, compact compute nodes, industrial systems, cloud infrastructure, and high-density enterprise deployments requiring powerful cooling performance within a low-profile form factor.

Built with a copper base and copper fin heatsink construction, the PL-LGA1700-1UC provides efficient heat transfer and stable thermal dissipation for low to mid-power Intel CPUs ranging from 65W to 150W TDP. The all-copper thermal design enhances conductivity and helps maintain stable processor temperatures during sustained workloads in enterprise and embedded computing environments.

The integrated 90mm PWM cooling fan operates between 1000 to 6000 RPM, delivering up to 18 CFM airflow for focused cooling performance within compact server chassis. Designed with a durable double ball bearing mechanism and 4-pin PWM control, the fan enables dynamic speed adjustment based on thermal load while maintaining long-term operational reliability in continuous-use environments. Despite its compact form factor, the cooler is capable of supporting demanding thermal conditions common in 1U rackmount systems.

With dimensions of 90mm x 89mm x 27mm and support for standard Intel LGA1700 mounting spacing, the PL-LGA1700-1UC is specifically engineered for square motherboard layouts and tight server installations. The reinforced mounting structure ensures secure contact pressure and dependable thermal transfer across Intel processors in high-density deployment scenarios.

Combining compact thermal engineering, all-copper construction, PWM-controlled airflow, and enterprise-grade reliability, the ProLab Design PL-LGA1700-1UC is an ideal cooling solution for compact servers, firewall appliances, embedded systems, edge compute nodes, industrial platforms, and low-profile enterprise infrastructure deployments.